Abstract
Coefficient of thermal expansion (CTE) of solder alloy Sn-37%Pb was estimated by using cluster expansion method. Five phases with available experimental CTE in Sn-Pb system were employed to derive the correlation coefficient, qi. Monte-Carlo simulation was carried out to obtain the correlation functions, ξ i . With the derived qi and ξ i , CTE of Sn-37%Pb was calculated, which is in excellent agreement with experiment. This study may provide a simple approach for the CTE prediction of disordered structures.
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