Abstract
Achieving a compound thin film with uniform thickness and high purity has always been a challenge in the applications concerning micro electro mechanical systems (MEMS). Controlling the adhesion force in micro/nanoscale is also critical. In the present study, a novel method for making a sputtering compound target is proposed for coating Ag–Au thin films with thicknesses of 120 and 500 nm on silicon substrates. The surface topography and adhesion forces of the samples were obtained using atomic force microscope (AFM). Rabinovich and Rumpf models were utilized to measure the adhesion force and compare the results with the obtained experimental values. It was found that the layer with a thickness of 500 nm has a lower adhesion force than the one with 120 nm thickness. The results further indicated that due to surface asperity radius, the adhesion achieved from the Rabinovich model was closer to the experimental values. This novel method for making a compound sputtering target has led to a lower adhesion force which can be useful for coating microgripper surfaces.
Highlights
Since miniaturization provides unique advantages such as reduced energy consumption, more effective portability, occupying less space, and improved performance, many industries have welcomed it
The results further indicated that due to surface asperity radius, the adhesion achieved from the Rabinovich model was closer to the experimental values
Ag–Au compound coatings with thicknesses of 120 and 500 nm were fabricated on the surface of silicon substrates employing a novel method for manufacturing a compound sputtering target
Summary
Since miniaturization provides unique advantages such as reduced energy consumption, more effective portability, occupying less space, and improved performance, many industries have welcomed it. Barajas-Valdes et al [20] examined the nanomechanical properties, including adhesion, of pure aluminum and aluminum-boron thin films manufactured by magnetron sputtering They deposited the thin films on glass substrates and silicon wafers. Rabinovich et al [27] considered contact mechanics theory to measure the interaction force They presented a physical model in which both the radius and the height of the asperities are utilized to calculate the adhesion force. This model is more reliable with a nano-scale roughness than other models for measuring the adhesion between the particle and surface.
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