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Abstract
The influence of the sample temperature during metallization on the electrical performance of silver contacts to c-axis oriented YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// (YBCO) thin films has been investigated. The specific contact resistance, /spl rho//sub c/, was measured for contacts of different lateral dimensions, prepared by in situ Ag deposition at different temperatures and defined by standard photolithography. When corrected for a non-uniform current distribution, this data shows that on average /spl rho//sub c/ is at least a factor 4 lower for contacts prepared by metallization on a heated (T/sub sub//spl ap/600/spl deg/C) YBCO surface than for contacts prepared by metallization at room temperature (RT). The improved electrical performance correlates with a distinct difference in the interfacial microstructure of similar contacts, previously observed with high-resolution transmission electron microscopy.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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