The UT/NIST/SA/ISMT Thermometry Test Bed - 2001

Abstract

This paper is a sequel to last year's progress report (Geyling et al., 2000) on the development of the Thermometry Test Bed, a joint project by UT (The University of Texas at Austin), NIST (National Institute of Standards and Technology), SA (SensArray Corporation) and ISMT (International SEMATECH). The test bed facility is evolving into a temperature standard, traceable to ITS-90, for commercial sensors targeting applications in RTP and (MO)CVD. The paper highlights key achievements during the past year, including modifications to the facility to accommodate commercial sensors. Results using a standard TC (thermocouple) Instrumented Wafer from SA are presented to characterize the performance of the Test Bed, as well as results from the first set of tests with a SA sandwich wafer and with NIST wafers using TFTCs (thin-film thermocouples). The fabrication of hybrid wafers (using both conventional thin wire TCs and TFTCs), which is at the heart of this test bed concept, is on-going and is briefly detailed. Several commercial sensor suppliers are preparing or have initiated tests of their pyrometers. The first pyrometer to be tested is the CI Systems NTM500, and results using this sensor are also reported.