The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components

P Trägner

doi:10.1155/apec.11.197

Abstract

One of the reasons for a reduction of production quality is the so-called ‘hidden faults’, i.e. defects which will not be detected by the available testing equipment in spite of measures for ensuring a good quality. These testing methods, which are mostly electrical, can be supplemented in a suitable way by non-contacting temperature measuring techniques, since the variation of temperature as a function of operating conditions and environment constitutes one of the most important problems in the design of electronic components and sub-assemblies, and of their reliability.In this paper a relation is presented between a qualitative diagnostic model, reserve stability and other characteristics, on the one hand, and the permissible thermal energy that can be radiated, on the other hand, which facilitates the detection of hidden faults.

Highlights

At all times the securing of high quality stable industrial products is one of industry’s essential tasks
In electronic devices the conversion of energy into heat will depend on the characteristic values of the components and on the existence of defects, given that all other conditions remain constant
If the range of hidden faults gives an excess temperature of about 30%, any larger excess temperatures would be associated with observable faults, the relative error, d, which is a function of AT will remain below that given by d 0.47 AT (%)

Summary

INTRODUCTION

At all times the securing of high quality stable industrial products is one of industry’s essential tasks. To a certain extent the application of non-destructive testing procedures allows one to detect deviations in the properties of electronic components and to determine in advance the reliability to be expected. Such testing can be done on a real time or an accelerated time basis, and avoids the necessity of having to wait for quantitative data on the frequency of failure and the failure modes themselves being forwarded from the user. In many cases the so-called hidden faults do not manifest themselves in a change of the characteristic observed by the electrical testing device Since they often cause a change in temperature of the individual component or of the temperature field over the component, temperature measurement is often a useful way of determining the possibility for potential failure in a component

PRINCIPLES OF ANALYSIS

General

Temperature Model

Findings

DISCUSSION AND CONCLUSIONS