The Use of Test Structures to Perform Chip Level Characterization Studies of Ni and NiFe Electrochemical Deposition

Abstract

This paper describes the first use of test structures designed to characterize the fundamental properties of nickel and nickel-iron alloy films deposited using electroplating. The structures are used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited films. The advantage of this methodology is that each electrolyte change does not require the replacement of the large volume bath associated with wafer scale manufacturing investigations, thereby, making the characterisation and optimization of electroplating baths far less time consuming, and considerably more cost effective.