Abstract
Low-melting noncrystallizing glasses are used as solders for connections of various metallic and nonmetallic parts. However, theoretical data on glass formation and physical parameters of low-melting glasses are still limited. The use of modelling allows to simplify the selection of a glass system as a solder by the mathematical description of the dependencies of both that the temperature coefficient values of linear expansion and other specific temperatures, which are necessary for a practical application. Therefore, the fourth-order regression polynomial models are offered for describing dependences of the temperature coefficient values of linear expansion, the softening temperature and the glass transition temperature from the component concentrations of the CaSO4-KPO3-Na2B4O7 low-melting glass system in the glass formation region. The model involver both pair and ternary interactions of the glass system’s components. The analysis of the obtained results showed that the concentration of the CaSO4 component has the highest effect on the temperature coefficient values of linear expansion.
Highlights
At present, the application of a leak-free and reliable bonding of parts, which are made of various kind of materials with each other is required in modern instrument engineering
The creation of strong junctions between parts requires from solders that the temperature coefficient values of linear expansion (TCLE) must be comparable, the complete spreading temperature during heat treatment, as a rule, must not exceed above 700 °C and the softening temperature must be below 450–600°С as well [2]
As shown by the regression analysis of the experimental dataset, the TCLE, Ts and Tg dependences on components composition of the glass system are well described by means of the regression model in the form of a fourth-order polynomial in contrast to the second-order one for the MgSO4-KPO3Na2B4O7 system [8]
Summary
The application of a leak-free and reliable bonding of parts, which are made of various kind of materials with each other is required in modern instrument engineering. Low-melting noncrystallizing glasses are used as solders for connections of various metallic and nonmetallic parts [1]. The creation of strong junctions between parts requires from solders that the temperature coefficient values of linear expansion (TCLE) must be comparable, the complete spreading temperature during heat treatment, as a rule, must not exceed above 700 °C and the softening temperature must be below 450–600°С as well [2]. Considerable experimental material concerning low-melting glasses in numerous glass-forming systems has already obtained [2,3,4,5,6]. The data about the properties such as TCLE, the softening temperature (Ts) and the glass transition temperature (Tg) for various glass systems is not generalized
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