Abstract
With the Large Hadron Collider (LHC) successfully collecting data at 7TeV and even at 8TeV since April 2012, plans are actively advancing for a series of upgrades in phase with the three long shutdown periods leading to detector improvement. The ATLAS collaboration will upgrade at the next shutdown in 2013–2014 its semiconductor pixel tracking detector with a new Insertable B-Layer (IBL) between the existing innermost pixel layer and the vacuum pipe of the LHC. The extreme operating conditions at this location led considering the development of new radiation hard pixel sensor technologies and a new front-end readout chip. The IBL community is currently working for producing modules with silicon planar and 3D technology towards the loading on 14 local stave structures as well as the integration around the beam pipe and in the ATLAS detector. The High-Luminosity LHC (HL-LHC) will eventually increase to about five times the LHC design-luminosity some 10-years from now requiring a complete Inner Detector replacement. With the increase luminosity, the cumulated radiation damages and the significant increase of the occupancy the current Inner Detector will not provide the required performances to fully exploit the discovery potential. An overview of the IBL features and construction will be described as well as some R&Ds investigations towards Phase-2 HL-LHC inner tracker upgrade.
Highlights
A number of pixels does not work after proton irradiation (TID ~ 3x Insertable B-Layer (IBL) lifetime) Same behavior for both sensor types => FE-I4 “feature” (Pixels masked during analysis) will be addressed with FEI4b
- Pixel FEI4b in production + R&D in 65nm - Strip ABCN130 to be submitted at the end of 2012 Cooling with more headroom: CO2 plant for coolant down to -35°C or lower New powering scheme: Serial powering or double chip (DC)-DC for parallel powering Faster readout: FE asics (160/320 Mbps) and optical link (5Gb/s)
The ATLAS ID to insert in 2013/14 a new innermost Pixel layer namely IBL IBL is possible thanks a new reduced beam pipe diameter in production IBL layout is a mix of planar and 3D sensor technology integrated on the stave The FEI4 readout chips is one of the key items which is working fine and the latest version is in production – used for future Upgrade development The IBL parts are in production – Schedule is on a fast track
Summary
IBL features: • 14 staves overlapping in Phi and mounted around the beam pipe on support rings • Small clearances between beam pipe - IBL - IST : 2.5 to 2.7mm • Stave to stave gap is only 0.8mm Integration for the last stave delicate • Instrumented stave made of 12 planar and 8 3D sensor modules along 664mm
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
