Abstract
The short range order structures of Sn-Bi eutectic melt has been studied by means of X-ray diffraction and reverse Monte-Carlo methods within 420 – 1120 К temperature range. Temperature dependences of interatomic distances and thermal expansion coefficient within first coordination sphere were calculated. Free volume temperature variation was investigated using Voronoi-Delone statistic-geometric method. Obtained data allowed us to find the occurrence of smeared structure transformation in Sn-Bi liquid eutectic and determine the temperature range of this transformation. Results of this study have a potential application in soldering technologies, particularly at improving of interface region properties.
Highlights
Rapid advancement of micro- and nanoelectronics compels the deeper studying of the soldering processes and their improving in order to construct more effectively the multifunctional electronic systems by connecting of few units
In the temperature range of 420 – 950 K, the local coefficient of thermal expansion is negative, while the coefficient of thermal expansion calculated according to the temperature dependence of the density is positive in the whole temperature range. Such a feature of the temperature dependence of the coefficient of thermal expansion indicates the compaction of the local liquid structure within the first coordination sphere, and at the same time the increasing in the volume of the liquid as a result of thermal expansion
It was found that in the vicinity of temperatures of 800 – 900 К there is a change in the sign of the temperature dependence of both interatomic distances and the quantities associated with them - the volume coefficient of thermal expansion and free volume
Summary
Rapid advancement of micro- and nanoelectronics compels the deeper studying of the soldering processes and their improving in order to construct more effectively the multifunctional electronic systems by connecting of few units. In order to avoid such disadvantages detailed study of physical-chemical factors, which can effect the diffusive processes and phase formation process at solder – substrate boundary One of the such factors is atomic structure of liquid solder and its variation with temperature, because the structure changes are related with change of most important for soldering properties. As follows from above mentioned the melting process and further heating of Sn-Bi melts is accompanied with structure transformation, occurrence of which has a significant influence on wetting, diffusion, phase formation and crystallization of alloys Taking into account such features, in this work we attempt to carry out the detailed studies of structure of liquid eutectic alloy Sn57Bi43 within temperature range 420 – 1120 К
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