The Three-Dimensional Displacement Measurement of Sandwich Circular Plates With a Single Fully-Potted Insert Using Electronic Speckle Pattern Interferometry

Abstract

This syudy presents the construction and operation of an electronic speckle pattern interferometry (ESPI) applied to sandwich plates with inserts [1]. Proposed ESPI is a full-field and non-destructive testing that can measures tiny out-of-plane and in-plane displacement in the elastic region[2, 3, 4]. The experimental construction is to integrate out-of-plane and in-plane measurement into one optical system, to measure the three-dimensional displacement of the sandwich plates. The experimental result indicates that the displacement of the sandwich plate will decrease as the core thickness is increasing (Fig. 1). The result also indicates that the displacement will decrease as the diameter of insert is increasing, but the strength estimated to be increasing (Fig. 2). For validation purpose, the analytical and FEM analysis were introduced to compare with the result of ESPI measurements. Comparison between the results of ESPI, FEM and analytical revealed a convincing agreement.