Abstract
The Au-Sn soldering alloys are commonly used in microsoldering process for microelectronic industry due to fluxless process and relatively low melting temperature with good eutectic microstructures. This study investigated the microstructures of Au-Sn soldering between AlTiC and Si substrates with Ti/Pt/Au under bump metallization (UBM). The microstructures of the solder samples under three conditions: before bonding, after bonding and after thermal-cycle aging, were investigated. The shear strength values of pre-aging and post-aging soldering were compared. The thermal-cycling temperatures were ranged from -40 to 125 °C for 300 cycles. The intermetallic compounds (IMCs) of the AuSn solders consist of AuSn, AuSn2, and AuSn4. After thermal-cycle aging, the bonding strength was increased due to the improved IMC bonding between solders and UBM; the shear surfaces were rougher due to the growth of AuSn and AuSn2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
