Abstract

Author proposes a new theory of virtual modeling of physical processes, which allows to obtain data enabling the designer of an onboard electronic means to build and see on the computer monitor a 3D image of the developed design. At the same time, physical fields obtained from virtual modeling of thermal and mechanical processes are superimposed on the design image. These fields enable you to define in which places of the actual design overheating, unacceptable deformations and accelerations on electronic components are possible. The results are displayed in the form of: thermal fields of printed circuit boards and other load-bearing structures, acceleration field on electronic components, and fields of mechanical stresses and deformations of load-bearing structures of onboard electronic means. In the work the author formulated requirements to the theory of virtual modeling of dissimilar physical processes in schemes and constructions, and developed the content of this theory. The author shows that the basis of the developed theory is modeling of dissimilar physical processes with the use of mathematical analogies and topological graphs.

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