The tensile impact properties of aged Sn–3Ag–0.5Cu/Cu solder joints

Abstract

The present study aims to evaluate the effects of isothermal aging on the mechanical properties of solder joints. To achieve this objective, the tensile impact behavior of lead-free Sn–3Ag–0.5Cu solder ball joints aged at 373K for times ranging from 24h to 1000h was investigated using an altered miniature Charpy impact-testing system. The experimental results showed that the tensile strength, the work-of-fracture and the fracture toughness of solder joints were found to decrease as the effective strain rate (or the loading speed) as well as the aging time increased due to a thicker IMC layer with a coarser nodule under thermal aging. In addition, the joint strength after isothermal aging under a tensile load was more sensitive to the strain rate than those in the shear loading mode. Specifically, equations representing the relationships among the effective stress, the strain rate and the aging time were established for the solder joints aged at 373K in this study. Furthermore, the mode II fracture toughness values were less than the mode I fracture toughness for each aging time condition of the solder joints.