Abstract
AbstractIn this paper, an attempt has been made to investigate the temperature field in a two‐dimensional thermoelastic medium with voids. This takes place when it is subjected to a time‐dependent temperature source under the conditions of conduction heat transfer and interaction between the thermoelastic medium and its surroundings. Analytical expressions of displacements, stresses, temperature increment, and change in the volume fraction field for a layer of thermoelastic medium and a half‐space thermoelastic problem are derived by using the Laplace and Fourier transformation techniques. Two scalar potential functions of the displacement are introduced in the solution process. Then, the integral transform is inverted by using a numerical technique, and numerical results are illustrated graphically to analyze the distribution of the fields. Furthermore, the influence of the thermo‐void coefficient for two kinds of temperature boundaries is discussed. A comparison is also presented with the corresponding half‐space thermoelastic model without voids to ascertain the validity and the difference between these models. © 2010 Wiley Periodicals, Inc. Heat Trans Asian Res; 39(7): 507–522, 2010; Published online in Wiley Online Library (wileyOnlinelibrary.com). DOI 10.1002/htj.20313
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