Abstract
As part of an experimental investigation of the capillarity and chemical basis of wetting and spreading as it applies to joining technology, the interfacial tensions between liquid lead-tin solder alloys and several gaseous and liquid fluxes have been measured by specially adapted classical techniques. Both an organic flux and liquid zinc chloride depress the interfacial tension over the full range of solder composition, the latter showing the more remarkable effect. The relevance of these measurements to the understanding of metal wetting and spreading behaviour is discussed.
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