The sub-model method for analysis of BGA joint stress and strain during random vibration loading

Abstract

This paper put forward a equivalent approach of high-density PCB assembly model, then use of sub-model on the local position of a second analytical solution. Firstly, the equivalent model, fine model and sub-model was established, and then modal analysis, random vibration analysis and sub-model analysis are performed. Comparison with the result data of the three models, it is verified the feasibility and correctness using of equivalent processing and sub-modeling techniques from the natural frequencies, mode, and stress distribution, maximum stress, maximum stress location, relative error of the maximum stress of the equivalent part. It is an effective method to analysis of high-density PCB assembly model. Finally, it is used the method to obtain the dynamic response of a particular high-density PCB assembly model under random vibration load.