Abstract
This essay makes the reliable analysis and modelling on printed circuit boards(PCB) by software of Flotherm and get conclusions of three points through simulation analysis:1) there is an important impact on heat transfer of the distribution of copper foil on PCB, and the actual condition should be selected for different precision simulation modules; 2) the heating device with simple structure and small thermal resistance can be dealt with as the simple square; 3) in the case of knowing the internal thermal resistance, integrated chip adopts double thermal resistance model as much as possible. In accordance with above inference, Flotherm modelling and simulation is carried out for certain printing circuit board, and computing results are compared with actual testing data to verify the correction of analysis methods.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
