Abstract
The processes of diffusion interaction of niobium filaments and a copper matrix in conductors manufactured by the internal tin method were investigated. The aim was to determine the effect of heat treatment modes on the structure and properties of a Nb/sub 3/Sn layer being formed in conductors with the centrally positioned Sn alloy. It was established that as a result of the doping of the matrix and filament materials, the overall critical current density (without taking into account the stabilizing copper) reaches into 5.12*10/sup 4/ A/cm/sup 2/ in a 16-T field and 2.08*10/sup 4/ A/cm/sup 2/ in a 18-T field.
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