Abstract
It is well known that heat generation will be harmful to high power LEDs. It is hardly effectively dissipated and results in a serious problem in the luminous efficiency. The most important issue in LED research is to find a potential design of heat removal. The purpose of this study is to design the LEDs combined with the cooling module of the aluminum-acetone flat plate heat pipe by the experimental and numerical simulation for obtaining high efficiency in heat removal. The high power LEDs with and without heat pipe cooling module are compared. The numerical simulation is built and agrees with the experiment. The heat removal efficiency of the cooling module reaches 92.09% and drops the junction temperature of LED about 36°C. This cooling module has proven to be effective in solving the heat concentration problems associated with the LED chips. In short, the phase change cooling module will apply on the electronic component of high heat concentration for more effective cooling method.
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