The Structure of Gold and Gold Alloys Produced Using High Speed Selective Jet Electrodeposition

Abstract

SUMMARYModern reel-to-reel plating facilities apply selective deposits of gold and gold alloys during the production of pressed copper and copper alloy or nickel-iron alloy strip components. These components are fabricated into electrical connectors or semi-conductor lead frames. Selectivity is usually achieved by the use of some form of dielectric masking. Recent developments have shown that such components may be plated with gold or gold alloys at deposition rates of up to 3.5 microns per second, selectively and without the need for masking. This paper discusses the microstructure of such deposits from studies using X-Ray diffraction and other physical testing methods and compares them with those produced under conventional deposition conditions.