The Structure of Electrodeposited Copper Examined by X‐Ray Diffraction Techniques

Abstract

X‐ray diffraction line profiles of copper, electrodeposited from an acid plating bath in the presence of thiourea, have been analyzed by Fourier techniques. From the coefficients data on microstrains, crystallite size, twin fault, and stacking fault densities were obtained. The stored energy and the dislocation density have been derived from the value of the rms strains. The sums of the determination of the Fourier coefficients of the various diffraction peaks were calculated with a computer. The particle size as determined by the Fourier analysis varies between 1350 and 180Aå. The smallest particle size is obtained in a plating bath with a thiourea concentration of 20 mg/1. The deposits contain no stacking faults; the microtwin density is high. The microstrains are strong, indicating high values for the stored energy, , and the dislocation density, . A relationship was established between hardness and strain. X‐ray results were compared with those obtained from electron microscopical observations on the same specimens.