The stimulation of angiogenesis and collagen deposition by copper

Abstract

Copper is known to trigger endothelial cells towards angiogenesis. Different approaches have been investigated to develop vascularisation in biomaterials. The angiogenic and healing potential of copper ions in combination with two major angiogenic factors was examined. A 3D culture system in which, under stimulation by FGF-2 and to a lesser degree with VEGF, endothelial cells assembled into structures resembling to an angiogenic process was used. The combination of CuSO 4 with increasing doses of VEGF or FGF-2 enhanced the complexity of angiogenic networks in a significant manner. In vivo studies were also conducted by incorporating FGF-2 with CuSO 4 in a cylindrical collagen-based scaffold. CuSO 4 enhanced significantly the invasion of microvessel compared to control implants and to 20 ng FGF-2 ± CuSO 4. Vascular infiltration was also significantly improved by combination of CuSO 4 with FGF-2, compared to FGF-2 alone (0.2 and 1 μg). Nevertheless, in comparison with CuSO 4 alone, there was a significant increase only with 1 μg of FGF-2 combined with CuSO 4. Significantly, collagen fiber deposition was enhanced following the combinatory loading in comparison to that with FGF-2 alone but not with CuSO 4 only. Thus, copper associated with growth factors may have synergistic effects which are highly attractive in the fields of tissue engineering (e.g., bone) and biomaterials.