Abstract

The STI stress effect is investigated based on the 0.13 μm SOI process developed by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS). It shows that the threshold voltage and mobility are all affected by the STI stress. The absolute value of the threshold voltage of NMOS and PMOS increased by about 10%, the saturation current of NMOS decreases by about 20%, while the saturation current of PMOS increases by about 20%. It is also found that the lower temperature enhances the STI stress and then influences the device performance further. Then a macro model for this effect is proposed and is well verified.

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