Abstract
AbstractDynamic differential scanning calorimetry (DSC) experiments of a single part epoxy paste adhesive SY-H2 were performed at multiple heating rates (β) ranging from 1.25 to 160 K/min. Test results of DSC were analyzed in different ways, which the initial cure temperature (Ti), the onset temperatures (Tonset), peak temperatures (Tp) and the finishing temperature (Tf) of DSC curves were both taken into consideration to calculate the apparent activation energy (Ea). Based on changes of the onset temperatures or peak temperatures (expressed as T*) with different heating rate (β), a linear equation, \(T^{*} = T_{1} + \Delta Tln{\upbeta }\), has been obtained to determine the curing temperature parameters more reasonably. The above equation can be used to explain some laws of higher or lower of apparent activation energies (Ea), by which the apparent activation energy (Ea) nearly equals to \(RT_{1}^{2} /\Delta T\).KeywordsCuring reaction kineticsAnalytical solutionApparent activation energy (Ea)
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