Abstract
In the present study, the application of TiAlSi interlayer to connect Ti/Mg bimetal composite was investigated. To obtain the entire TiAlSi compounds as interlayer, TC4 substrate was hot dipped into Al–15Si melt and further treated by heat treatment. After that, TC4/AZ91D bimetal composite was achieved by solid-liquid compound between solid Al–Si coated TC4 and liquid AZ91D melt. The interface microstructures of the Al–Si coated TC4/AZ91D were observed by scanning electron microscope (SEM) and transmission electron microscope (TEM). The results revealed that the nanophases mixture zone consisted of Ti5Si3, Ti(Al, Si)3, τ-Ti7Al5Si12 and twin crystal of Ti5Si3/Ti7Al5Si12 was formed between Mg and the interlayer. The eutectic structure was replaced by the nanophase mixture zone, and the bonding strength was improved significantly. The evolutions of TiAlSi interlayer during hot-dip process, heat treatment process, and solid-liquid compound process were discussed in detail.
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