Abstract
The central role of the copper in power technologies depends on its electrical conductivity even if also the metal shape and profile are important parameters: in fact many recent applications in MEMS field require copper deposits showing very flat profile. Through the mask copper electrochemical deposition (ECD) has become a suitable technology in order to get copper bumps showing the required geometrical features. Our aim was to find the plating conditions that permit to get extremely flat copper profile, using a commercial bath (CuBath, ATMI), without neglecting the uniformity and the roughness, by means of the Semitool-Equinox. The organic additive range in the plating bath resulted to be the main responsible of the shape of the copper. This research was very useful in plating very flat copper studs having far good within die (WiDU%) and within wafer (WiWU%) uniformity. The results were implemented in different products.
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