Abstract
New polyurethane (PUR) adhesives containing covalent Diels-Alder (DA) bonds that can break and form with temperature have been recently developed for sustainable multilayer packaging. The understanding of the mechanical properties and in particular of creep in terms of molecular architecture appears of outmost importance in view of their applications and potential reutilization. Oscillatory shear rheometry shows a modulus decrease with temperature associated to bond breakage and the enhancement found upon cooling can be associated with network reconstruction. Analysis of storage modulus values above the glass transition and below the retro-DA reaction suggests a lower network crosslinking density with increasing adduct content. Room temperature indentation and shear rheometry tests reveal that DA bonds improve the modulus and reduce the resistance to linear viscoelastic flow. The modulus improvement can be associated to the enhanced chain rigidity introduced by the DA moieties and the reduced creep resistance seems to be related to the decrease of crosslinking density.
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