Abstract
The mechanisms of oxygen incorporation during dry thermal oxidation of 6H-SiC wafers were investigated. Isotopic tracing of oxygen was performed by sequential oxidations in dry O2 enriched or not in the 18O isotope and subsequent determinations of the 18O profiles. The results obtained with SiC substrates were compared with those of Si, evidencing different mechanisms of oxygen incorporation and transport. The gradual nature of the SiO2/SiC interface was also evidenced. A probable explanation for this gradual SiO2/SiC interface is shown to be the formation of C clusters during oxidation.
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