Abstract
The eutectic Ag-Cu composition is a common brazing alloy. A complex ion bath containing KAg(CN)2, CuCN, KCN and K4P2O7 was used to codeposit Ag and Cu. The effects of KAg(CN)2, KCN and K4P2O7 concentrations on the composition and morphology of electrodeposited Ag-Cu films was investigated in this study. A constant CuCN concentration of 0.1 M was used. The increase in KCN and KAg(CN)2 concentrations caused major increases in Ag contents, but increase in K4P2O7 concentration caused a minor decrease in Ag content of the film. The deposits were found to be globular clusters when high KAg(CN)2 concentrations were used. Finer microstructures and higher Ag contents were observed in deposits produced in electrolytes containing higher KCN concentrations.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
