Abstract
This study examined the ternary Ni2SnP layer in Sn‐3.5Ag/EN‐P solder joints by using in situ transmission electron microscopy (TEM). The TEM analyses confirmed that Sn from the solder diffused into the P‐rich Ni layer through the ternary Ni‐Sn‐P layer. However, Ni was neither detected in the solder region nor formed an additional Ni3Sn4 IMC layer at the interface between the solder and the ternary layer during the in situ annealing in the TEM. This suggests that the ternary Ni‐Sn‐P layer acts as a diffusion barrier to Ni during the aging process. Copyright © 2012 John Wiley & Sons, Ltd.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
