Abstract
AbstractEmpirically based failure rate modelling methodologies employed in reliability prediction handbooks, and deterministic modelling methods are both critically examined using microelectronic packages as vehicles. As an alternative, a coupled mechano‐stochastic approach to reliability prediction modelling is presented. The goal is to use physics of failure principles with appropriate failure probability density distributions to design for failure‐free operation and predict failure times for components now available, as well as new components resulting from new materials, technologies and processes. In addition, an approach for extending the model to aid in logistics support analysis is discussed.
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