Abstract
The Au–Al bonding joint was prepared by the parallel gap resistance microwelding. The microstructural evolution of Au–Al bonds was investigated under thermal aging, and the mechanical properties of Au–Al intermetallic compounds (IMCs) were computed by the first-principles calculations. We found that the Au–Al IMCs along with cracks grew during aging time and temperature increasing. The formation of the cracks is explained by the Kirkendall effect, volumetric shrinkages and thermal mismatch. Based on the experimental data, the growth of the IMCs is fitted to the diffusion equation to describe the performance degradation of Au–Al bonds. The Arrhenius relationship is introduced as the acceleration model to describe the effects of thermal stress on lifetime. Furthermore, the Weibull–Arrhenius model is built by the combination of the Weibull distribution and the Arrhenius relationship, which provide a method to estimate the lifetime distribution under work condition.
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