Abstract

The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

Highlights

  • The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL)

  • The matching between the different readout schemes and the unique BOC-Readout-Driver card (ROD) architecture is mainly obtained by varying the number and the type of plug-ins into the BOC

  • During the current LHC shutdown the ATLAS experiment will upgrade the Pixel Detector with the insertion of an innermost silicon layer, called the Insertable B-layer (IBL) [3], which will be interposed between a new beam pipe and the B-layer

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Summary

Overview of the IBL readout electronics

New off-detector electronics [5] have been designed as well; new BOC and ROD versions will be produced. Each card pair has to process data received from 32 FE-I4 data links for a total I/O bandwidth of 5.12 Gb/s, four times greater than the existing ROD-BOC pair. Since each BOC-ROD pair is designed to serve the number of FE-I4s contained in one stave, 14 pairs in total are required. There is one additional BOC-ROD pair for the diamond beam monitor detector. These have to be installed and hosted in one full VME crate. A complete description of the ROD hardware can be found in [8]; even though the card shown in that document is revision B, no significant changes have been introduced in the last production (revision C — shown in figure 2)

The ROD production and commissioning
Findings
Review on upgrade for read-out electronics of Layer 1 and Layer 2
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