The quantitative analysis of loop-growth and void-swelling in nickel

Abstract

Dislocation loop and void growth experiments at several temperatures in the HVEM have been used to investigate point defect behaviour in nickel. It has been found that the dislocation bias is about 5% for interstitials and that voids also have a preference for interstitial defects. The value of the void bias is much less than the dislocation bias, being about 0.5%, so that swelling still occurs. The vacancy migration energy, E v m , has been confirmed to be 1.1 ± 0.1 eV.