The process modelling of the infra-red reflow soldering of printed circuit board assemblies

Abstract

Journal of Electronics ManufacturingVol. 02, No. 01, pp. 23-29 (1992) PAPERSNo AccessThe process modelling of the infra-red reflow soldering of printed circuit board assembliesDAVID C. WHALLEY, ADEBAYOO OGUNJIMI, PAUL P. CONWAY, and DAVID J. WILLIAMSDAVID C. WHALLEYManufacturing Engineering Department, Loughborough University of Technology, Loughborough LE11 3TU, UK Search for more papers by this author , ADEBAYOO OGUNJIMIManufacturing Engineering Department, Loughborough University of Technology, Loughborough LE11 3TU, UK Search for more papers by this author , PAUL P. CONWAYManufacturing Engineering Department, Loughborough University of Technology, Loughborough LE11 3TU, UK Search for more papers by this author , and DAVID J. WILLIAMSManufacturing Engineering Department, Loughborough University of Technology, Loughborough LE11 3TU, UK Search for more papers by this author https://doi.org/10.1142/S0960313192000054Cited by:12 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThis paper presents the latest results of an evolving model of the infra-red reflow soldering process. Recent additions to earlier, purely radiative heat-transfer, models are convective heating of the board as it passes through the furnace, convective cooling of the PCB as it exits from the furnace muffle, and the addition of realistic component structures to the PCB assembly. These component structures have been built using representations of increasing resolution to show the levels of model that must be constructed to model entire PCB assemblies. The paper also discusses the results from a further model of a high production-volume, high-quality, mass-manufacture oven and presents the results of an experimental programme to measure the effects of convection.Keywords:Reflow solderingprocess modellingsimulation FiguresReferencesRelatedDetailsCited By 12Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data FusionTin Lun Lam1 Jan 2021 | IEEE Access, Vol. 9A Novel On-board Temperature Monitoring Approach in the Reflow Soldering ProcessZhancheng Wang, Weimin Li, Hang Tong and Yangsheng Xu1 Oct 2006Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air InjectionYoung-Seok SON and Jee-Young SHIN1 Jan 2005 | JSME International Journal Series B, Vol. 48, No. 4A simplified reflow soldering process modelD.C Whalley1 Jul 2004 | Journal of Materials Processing Technology, Vol. 150, No. 1-2Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering.Young-Seok SON and Jee-Young SHIN1 Jan 2003 | JSME International Journal Series B, Vol. 46, No. 2The finite element modelling of laser soldering for electronic assembliesP. M. Beckett, A. R. Fleming, J. M. Gilbert and D. G. Whitehead1 January 2002 | International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, Vol. 15, No. 3A simplified model of the reflow soldering processDavid C. Whalley and Stuart M. Hyslop1 Apr 2002 | Soldering & Surface Mount Technology, Vol. 14, No. 1Numerical modelling of scanned beam laser soldering of fine pitch packagesP.M. Beckett, A.R. Fleming, J.M. Gilbert and D.G. Whitehead1 Apr 2002 | Soldering & Surface Mount Technology, Vol. 14, No. 1Simulation of Heat Transfer in a Reflow Soldering Oven With Air and Nitrogen InjectionY. S. Son, T. L. Bergman and M. T. Hyun1 December 1995 | Journal of Electronic Packaging, Vol. 117, No. 4Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive ProductsD J Williams, P P Conway and D C Whalley9 August 2016 | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Vol. 207, No. 2Effective transient process modelling of the reflow soldering of printed circuit assembliesF. Sarvar and P.P. ConwayA simplified model of the reflow soldering processD.C. Whalley Recommended Vol. 02, No. 01 Metrics History Received 1 September 1991 Accepted 1 October 1991 KeywordsReflow solderingprocess modellingsimulationPDF download