Abstract

The feasibility of current proposals for electron beam exposure systems depends heavily on the availability of electron resists of high sensitivity (greater than 100 m2/coulomb) in which relief images with submicron features can be made. An acrylate‐based polymer system (a terpolymer of glycidyl methacrylate, ethyl acrylate, and methyl methacrylate partially esterified with methacrylic acid) containing epoxy and vinyl reactive sites has been found to be a promising negative electron resist system, called CER, whose characteristics include high sensitivity (125 m2/coulomb), good adhesion to and metals, and good chemical resistance to etchants for these materials. The composition, characteristics, and processing of CER are presented here in detail.

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