Abstract
The leaching kinetics of a Cu‐39 weight percent (w/o) Al‐17.8 w/o Zn alloy over a range of leachant temperatures and concentrations were found to be liquid‐phase diffusion controlled within the porous reaction product layer of Raney copper. High concentrations in the leached grains at the product alloy interface result in deposition of significant amounts of . Further from this interface, the kinetics of secondary dissolution of from the porous copper are shown to be first order with respect to hydroxyl ion concentration. Because the coverage of copper by is frequently less than a monolayer, the secondary dissolution process is also dependent on residual zinc concentration. A Langmuir‐Hinshelwood adsorption model for the dissolution process, coupled with liquid‐phase diffusion of both and , is shown to describe accurately the zinc concentration profiles and to yield reasonable estimates of the diffusion coefficients.
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