Abstract
This article presents the results of deformation-strength properties measurement and microstructural analysis of heterogeneous polymer matrix consisting of thermoset and thermoplastic polymers. Thermosetting material is a diamino-diphenil sulfon-cured epoxy oligomer. Polysulfone was used as thermoplastic material. Two different technological processes were used to obtain heterogeneous polymer matrix: the material was mixed in the block, or layered material was produced in which a layer of thermoplastic material alternated with a layer of epoxy oligomer.
Highlights
Polymer composite material (PCM) matrix ensures the material solidity and uniform load distribution between the reinforcing elements, resulting in the growth of cracks deceleration, as well as stress transfer and distribution
Two different technological processes were used to obtain heterogeneous polymer matrix: the material was mixed in the block, or layered material was produced in which a layer of thermoplastic material alternated with a layer of epoxy oligomer
The value of adhesive power slightly decreases depending upon the thermoplastic polymer increase
Summary
Polymer composite material (PCM) matrix ensures the material solidity and uniform load distribution between the reinforcing elements, resulting in the growth of cracks deceleration, as well as stress transfer and distribution. The most widespread matrix used in production of PCM construction products is epoxy-based binding. The main advantages of epoxy bindings are high adhesive durability, good technological effectiveness, small swelling levels and very good technological properties. This allows creating materials which can be cured at the room temperature (cold-curing binding) and at increased temperatures (hot-curing binding). The purpose of this work is the development of the epoxy binding with improved deformation properties. To achieve this goal, thermoplastic polymers were used as plasticizers
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