Abstract
The tensile behavior of [001]-oriented disordered Cu 3Au single crystals was studied by stress-strain measurements, slip line studies and transmission electron microscopy. The crystals tested in multiple-slip orientation showed an initial yield drop followed by a linear work-hardening stage. Disordered Cu 3Au crystals exhibited a lower work-hardening rate than that of pure copper. The lower work-hardening rate is due to the presence of a dislocation multipole structure with smaller long-range stress fields in disordered Cu 3Au compared with a dislocation cell structure with relatively larger long-range stress fields observed in pure copper.
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