The Parametric Design of Adhesive Dispensing Process with Multiple Quality Characteristics

Abstract

In recent years, electronic industry trend moves toward miniaturizing its electronic components. Nevertheless, the functionality of these electronic components has grown stronger in order to keep up with the world’s technology advances and demand. The electronics manufacturing companies are always searching for new and better ways to make their products more efficiently, while protecting the environment in accordance to the restriction of hazardous substance (RoHS) directive, which was announced by the European Union. However, the implementation of such directive generated some setbacks in the electronics assembly process with surface-mount technology. This paper focuses on the quality performance of the component’s glue adhesion strength, considering multiple quality characteristics such as the vertical and horizontal thrusts at low and high temperatures. The Taguchi method assisted in designing and implementing the experiments. Process factors considered include the dispensing position, thermoset temperature and reflow conveyor speed. The multi-criteria analysis methods, the order preference by similarity to the ideal solution (TOPSIS) together with the principal component analysis (PCA), are employed to analyze the experimental data acquired. The optimal process parameters are thus determined. Lastly, a confirmation test is conducted to verify the results of the optimal process scenario.