Abstract
Underpotential deposition, i.e. the cathodic deposition above reversible potential E(Men+/Me), produces an atomic layer of a metal on a semiconductor electrode, such as e.g. bismuth telluride. This phenomenon allows electrodeposition of superlattices formed of building blocks of a layered semiconductor structure joined by biatomic metal interlayer. This work outlines the optimized pulse potential controlled electrodeposition of (Bi2)m(Bi2Te3)n films produced under mentioned above technique. The influence on the morphology of the electrodeposited films of key-parameters as applied pulse frequency, duty cycle, a routine of sodium dodecyl sulfate introduction in the electrolyte is discussed. The optimized procedure comprises a short (about 10 s) cathodic pre-treatment at high overpotential of the cathodic reaction, the subsequent periodic switching for 120 min between potentials of electrodeposition and refinement at 0.1 Hz and 5% duty cycle with addition of surfactant 60 min after the start of the electrodeposition.
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