Abstract
Thicknesses of films formed on the copper in alkaline solution in the presence of alanine are studied by ellipsometric method. It was found that small additives of β-alanine (10-4-10-3 mol/l) cause additional stabilization of copper passivity due to an increase in the film thickness. The adsorption kinetics of α- and β-alanine is studied. It is shown experimentally that β-alanine adsorbs on copper according to the Frumkin isotherm. By contrast, no definite type isotherm can be obtained for α-alanine due to its higher activity and ability to form soluble complexes with copper ions.
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