Abstract

For plasma enhanced chemical vapor deposition (PECVD) chamber cleaning, the in-situ plasma cleaning method was widely used with C3F8/N2O/O2 and NF3/He sources. A high efficiency NF3 in-situ cleaning recipe is demonstrated in diluting with diatomic gas, N2. With lower first ionization energy and several dissociative electron attachment (DEA) reactions, the N2 is characterized as catalyst and increase the dissociation of NF3. The cleaning uniformity problem is also solved by statistical design of experiment (DOE) approach; the well-optimized NF3/N2 cleaning recipe offers 79.6% less PFC emission than C3F8 in-situ chamber clean.

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