Abstract
The arrayed microcolumn structure called monolithic column module (MCM) has strong benefits affording high throughput for the next generation lithography'. However, this structure has inevitably not only many interconnection components, but also unwanted parasitic RC delay differences among wired electrodes. Recently, multi-layer Low Temperature CO-fired Ceramic (LTCC) technology has drawn attention for many applications, due to its 3 dimensional integration capability, low resistance metallization and cost effectiveness as well as its capability of multi-layer circuit integration which enables functional circuits within the block'. A Multi-layer LTCC system is made by laminating together green (unfired) sheet containing printed interconnections and components defined with low loss conductor metal such as silver(Ag), and then by firing the structure to form a rigid monolithic ceramic multilayer circuit especially with high conductivity and high circuit density3.
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