The morphology and structure of PVD ZrN–Cu thin films

Abstract

ZrN–Cu thin films containing variable amounts of copper, namely 8, 33 and 58 at%, were produced by reactive pulsed unbalanced magnetron sputtering. Coatings were found to possess hardness values of 22.5 GPa, 9.5 GPa and 3.7 GPa, respectively. The morphology of coatings was investigated by field emission gun scanning electron microscopy and the structure (microstructure and nanostructure) was investigated by conventional (bright-field and dark-field imaging) and high-resolution transmission electron microscopy. Complementary x-ray diffraction experiments were also performed.ZrN coatings containing 8 at% of copper were found to possess a nano-columnar structure composed of ZrN columnar grains, the diameter of which was approximately 15–35 nm. The majority of the copper content was apparently dissolved within the ZrN grains, rather than existing as a separate phase. Coatings of the two other compositions were found to be composed of a mixture of mostly equiaxed ZrN and Cu nano-crystalline grains, the diameters of which were in the approximate range 5–25 nm. None of the coatings investigated in this study were found to possess the so-called ‘nanocomposite’ structure, which is often envisaged as crystalline nano-grains surrounded by a thin amorphous intergranular phase. Instead, coatings were found to be either single-phase ZrN (with Cu in substitutional solid solution for Zr) or a mixture of ZrN and Cu nano-grains.