Abstract
With the development of high-performance wide-band-gap devices and increasing converter frequency, planar transformers are widely used in high-frequency and high-power-density power conversions. Due to the skin effect and proximity effect, accurate thermal analysis and a simplified thermal model of planar transformers are needed for quick thermal verification as well as system design. This paper proposes two thermal simplification models based on the planar transformer’s thermal impedance network. The internal power loss and thermal coupling between each component are first analyzed. Then, based on thermal radiation theory, the simplified thermal model of the planar transformer is presented. It only requires the input of the total power loss of the planar transformer to calculate the temperature rise, and it does not need the power loss of each component. Finally, the simulation and experimental verification are carried out on a MHz prototype.
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