The microsystems fabrication by precision laser/microprocessing

Abstract

Microsystems like micro-electro-mechanical systems (MEMS) need to use high precision microprocessing technologies. These fine structural components as micro and nanosized machined parts usually require postfabrication processes or assembly in order to become finished devices. We have focused our research results on two main substrates materials for Microsystems fabrication like silicon and ceramics. So we analyze on the paper the precision laser microcutting and singulation of individual chips of MEMS on these finished wafer substrates. So the precision microcutting and different contouring profiles need to establish first at all specific processing parameters of laser microcutting and scribing process. Meantime the high accuracy of MEMS parts fabrication improves to realize very high processing tolerances which will be detailed shown on the paper. The controlling process parameters by using the statistical process control applied to laser scribing process permit to produce lasers dies on ceramics a/o silicon substrates to Microsystems requirements. The paper analyze too the key controllable variable in the process as pulse depth, line location and variation of XY movement of the table. The best result shown on the paper for a wide range of substrates materials like silicon, ceramics, glass plate, single crystal ferrite and gallium phosphate recommend this innovative technology for MEMS fabrication.Microsystems like micro-electro-mechanical systems (MEMS) need to use high precision microprocessing technologies. These fine structural components as micro and nanosized machined parts usually require postfabrication processes or assembly in order to become finished devices. We have focused our research results on two main substrates materials for Microsystems fabrication like silicon and ceramics. So we analyze on the paper the precision laser microcutting and singulation of individual chips of MEMS on these finished wafer substrates. So the precision microcutting and different contouring profiles need to establish first at all specific processing parameters of laser microcutting and scribing process. Meantime the high accuracy of MEMS parts fabrication improves to realize very high processing tolerances which will be detailed shown on the paper. The controlling process parameters by using the statistical process control applied to laser scribing process permit to produce lasers dies on ceramics a/o sil...