Abstract
To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.
Highlights
In the past few years, the solder of Sn-Pb has been used in the electronics industry on a large scale because of its unique properties, such as lower cost, better wettability, and ideal mechanical properties [1,2]
The results showed that antimony changed the microstructure of Sn-3.5Ag, resulting in solid solution hardening
This study studied the thermal properties, microstructure, and mechanical behavior of
Summary
In the past few years, the solder of Sn-Pb has been used in the electronics industry on a large scale because of its unique properties, such as lower cost, better wettability, and ideal mechanical properties [1,2]. Adding many alloy elements, like In, Ni, Sb, Ga, etc., to Sn-Ag-Cu solder allows obtaining a high-temperature lead-free solder that has good thermal and mechanical behavior [16,17,18,19]. Research showed that the addition of Sb could inhibit the formation of coarse β-Sn and refine the precipitation of Ag3 Sn, thereby improving the mechanical and thermal behavior of Sn-Ag-Sb solder [8,20]. The study of Mahmudi and Mahin-Shirazi [1] showed that the tensile strength and plasticity of solder alloys could be improved by adding 1.5 wt.% Sb to Sn-3.5Ag alloys. The solid solution hardening effect of Sb increased the strength This increase in plasticity is due to the refinement of the alloy structure.
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