The method and degree of grinding as factors in the grinding and washing kinetics of silicon carbide

Abstract

An analysis was carried out of the influence of the method and degree of grinding on the grain size and washing kinetics of silicon carbide. Grinding silicon carbide in a ball mill requires more time than grinding in a vibro mill. In the latter a given degree of fineness is achieved in four hours compared with 30–40 hours in a ball mill. Wet grinding does not give a finer silicon carbide but merely increases its iron content which is an undesirable result.