The mechanics of single crystal Cu machining at nanoscale

Abstract

The objective of this study is to identify the mechanics of machining at nano scale on single crystal Cu with (100), (110) and (111) crystallographic orientations. A nano indenter equipped with a nano scratching attachment was used for machining operations and in situ observation of a nano scale groove. As a machining parameter, the depth of cut was varied in this study. Both elastic and plastic deformations were significant during machining. The plastic deformation was responsible for causing the ploughing and cutting mechanisms to produce the nano scale groove. The presence of the ploughing and cutting g mechanisms was determined based on the pile up volume and the cutting volume respectively.